Subtle defects and irregularities on the wafer surface can be identified and quantified

In the semiconductor manufacturing and processing industry, the surface quality of the wafer has a direct and important impact on the performance of the device. Therefore, accurate measurement of wafer surface roughness has become a key step to ensure product quality. The measurement of surface roughness is mainly to quantify the roughness of the wafer surface microstructure.

The FIS4 four-wave transverse shear interferometry technique is particularly prominent in this application because of its ability to detect very small wave front changes. It can identify and quantify subtle defects and irregularities on the wafer surface, which are important factors affecting device performance. The FIS4 technology has excellent vibration resistance and can be integrated directly into semiconductor production lines to monitor the surface roughness of wafers in real time, ensuring that each wafer meets stringent quality standards.

The production process integrated with FIS4 technology provides continuous quality monitoring, timely detection of production defects and reduction of scrap rates, thereby optimizing production efficiency and cost control. In addition, the non-contact nature of the FIS4 technology guarantees that no physical damage will be caused to wafers during the measurement process, which is essential for maintaining high quality production. Through automated data analysis, it can also provide fast and accurate feedback, further improving the level of intelligence and automation of production lines. Therefore, the FIS4 sensor is an important tool to improve the quality of semiconductor production.

Measurement advantage

Complete measurement with a single frame

 

◆ Roughness measurement

◆ Support online measurement

◆ Support white light, UV lighting

High resolution

 

◆ Up to 512×512 phase sampling points

◆ High dynamic range

◆ Nanoscale sensitivity

Easy to adjust integration

 

◆ Small and compact

◆ Support parallel and convergent beams

◆ Super vibration resistance

Measurement example

Wafer surface roughness detection optical path

      

Wafer surface roughness detection

Measurement demonstration

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