Resolve microscopic structure details at the micron or even nanometer level, providing accurate three-dimensional surface profiles
The application of four-wave transverse shear interferometry (FIS4) technology in the measurement of micro-etching topography is mainly reflected in the following aspects:
1. High resolution at the microscopic scale: The FIS4 technology is able to resolve the details of the microstructure at the micron or even nanometer level, which is crucial for evaluating the effect of the etching process. It can clearly reveal the microscopic morphology of the surface after etching, including the pits, lines and other features caused by etching.
2. Quantification of etching depth and uniformity: In micro-machining, etching depth and uniformity have a direct impact on product performance. FIS4 provides an accurate 3D profile of the surface, making it possible to measure the depth of etching and assess its uniformity across the surface.
3. Detection of microscopic defects: The microscopic etching process may introduce or expose surface defects, and FIS4 technology can help detect these defects so that they can be corrected or optimized in subsequent production steps.
4. Non-destructive measurement: As a non-contact measurement method, FIS4 technology does not cause any damage to the micro-etched surface of the measurement, which is essential to maintain the integrity of the microstructure.
5. Fast, real-time measurement capabilities: FIS4 technology enables fast data acquisition and processing, which means that it can provide real-time feedback during the production process, allowing for immediate process adjustment and optimization.
6. Measurement of complex structures: FIS4 technology is not only suitable for planar structures, but can also measure complex three-dimensional structures such as microlens arrays, gratings and other micro and nano structures.
7. Integration with the machining process: Due to its anti-vibration properties and fast response capability, FIS4 technology can be directly integrated into the production line of micro-machining to monitor the stability and repeatability of the etching process.
Through the application of FIS4 technology, manufacturers can better control the microscopic etching process, optimize product design, and improve product consistency and reliability. This is particularly important in semiconductor manufacturing, microfluidic device fabrication, photonic crystal processing and other fields.
Measurement advantage
Complete measurement with a single frame
◆ Microtopography measurement
◆ 3D topography analysis
◆ Support white light
High resolution
◆ Up to 512×512 phase sampling points
◆ High dynamic range
◆ Nanoscale sensitivity
Easy to adjust integration
◆ Small and compact
◆ Support parallel and convergent beams
◆ Super vibration resistance
Measurement example
▎Micro etching morphology measurement optical path
▎Defect sample 1#-114 cut lines
Measurement demonstration
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