Small changes on the surface of optical components are detected with nanoscale resolution
Component profile measurement is a key step in the manufacturing and quality assurance process of silicon wafers and optical components, and FIS4 four-wave transverse shear interferometry technology provides a fast and effective solution. The core benefits of this technology are:
1. High resolution and sensitivity: FIS4 technology can detect small changes in the surface of optical components with nanoscale resolution, which is essential for the pursuit of high precision optical manufacturing.
2. Detailed 3D profile: FIS4 provides a more detailed 3D profile than traditional point measurements or line scans, providing a wealth of data for understanding and analyzing component surface quality.
3. Robustness: The technology has excellent resistance to environmental factors such as mechanical vibration, ensuring the reliability of the measurement results, suitable for the changeable laboratory and industrial field environment.
4. Real-time measurement capability: FIS4 supports real-time measurement, which is critical for real-time quality monitoring and control on the production line, enabling timely detection and adjustment of production defects.
5. Easy integration: This technology can be easily integrated into existing optical test platforms and used in conjunction with other measurement tools such as interferometers and profilers to enhance the integrity of quality assessment.
Measurement advantage
Complete measurement with a single frame
◆ Real-time measurement of surface distribution
◆ Comprehensive 3D distribution display
◆ Support more than 300mm large caliber
High resolution
◆ Up to 512×512 phase sampling points
◆ High dynamic range
◆ Nanoscale sensitivity
Easy to adjust integration
◆ Small and compact
◆ Support parallel and convergent beams
◆ Super vibration resistance
Measurement example
▎Surface shape measurement optical path
▎Optical plane face shape
Measurement demonstration
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